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Solder joint reliability

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Solder joint reliability

Solder joint reliability

Ricky Lee S.W.

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คุณชอบหนังสือเล่มนี้มากแค่ไหน

คุณภาพของไฟล์เป็นอย่างไรบ้าง

ดาวน์โหลดหนังสือเพื่อประเมินคุณภาพของไฟล์

คุณภาพของไฟล์ที่คุณดาวน์โหลดมาเป็นอย่างไรบ้าง

ปี:

2004

ภาษา:

english

จำนวนหน้า:

112

ISBN 10:

086176966X

ISBN 13:

9780861769667

ไฟล์:

PDF, 5.67 MB

IPFS:

,

english, 2004

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การแปลงเป็น ล้มเหลว

คุณอาจสนใจ

SCILLC — Soldering and Mounting Techniques. Reference Manual

Peter Grundy — Solder Paste Jet Printing

Ning-Cheng Lee PhD — Reflow Soldering Processes

Andrew E. Perkins, Suresh K. Sitaraman — Solder Joint Reliability Prediction for Multiple Environments

Rudolf Strauss — SMT Soldering Handbook

MIKE JUDD, Keith Brindley — Soldering in electronics assembly

Karl J. Puttlitz, Kathleen A. Stalter — Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Dongkai Shangguan — Lead-free Solder Interconnect Reliability

King-Ning Tu — Solder Joint Technology

Desconocido — Electronics Mfg With Lead Free Halogen Free and Conductive Adhesive Mtls McGraw Hill 2004

Unknown — Electronics Mfg With Lead Free Halogen Free and Conductive Adhesive Mtls McGraw Hill 2004

Desconocido — Electronics Mfg With Lead Free Halogen Free and Conductive Adhesive Mtls McGraw Hill 2004

Unknown — Electronics Mfg With Lead Free Halogen Free and Conductive Adhesive Mtls McGraw Hill 2004

Desconocido — Electronics Mfg With Lead Free Halogen Free and Conductive Adhesive Mtls McGraw Hill 2004

Desconocido — Electronics Mfg With Lead Free Halogen Free and Conductive Adhesive Mtls McGraw Hill 2004

— Electronics Mfg With Lead-Free, Halogen-Free, and Conductive-Adhesive Mtls

Clyde F. Coombs Jr. & Happy Holden — Printed Circuits Handbook, Seventh Edition

Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson — Reliability of Microtechnology

Ken Gilleo — Area Array Packaging Handbook: Manufacturing and Assembly

Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao — Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Jennifer Shepherd (auth.), Jasbir Bath (eds.) — Lead-Free Soldering

K.N. Subramanian, KN Subramanian — Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

John X. Wang (Author) — Green Electronics Manufacturing: Creating Environmental Sensible Products

Edwin Bradley, Carol A. Handwerker, Jasbir Bath, Richard D. Parker, Ronald W. Gedney — Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing

Ephraim Suhir, T. X. Yu, David S. Steinberg — Structural Dynamics of Electronic and Photonic Systems

— Lead-Free Solder Process Development

Edwin Bradley, Carol A. Handwerker, Jasbir Bath, Richard D. Parker, Ronald W. Gedney — Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing

Sanka Ganesan, Michael G. Pecht — Lead-free Electronics

British Standards Institute Staff — Process Management for Avionics. Aerospace and Defence Electronic Systems Containing Lead-Free Solder. Technical Guidelines

JAYNE BROOKS — YHT Cover.qxd

tracy — YHT Cover.qxd

Puligandla Viswanadham, Dereje Agonafer — Essentials of electronic packaging: a multidisciplinary approach

Narayan Prabhu; ASTM Committee D-2 on Petroleum Products and Lubricants — Lead-free solders

Cain Tubal — Soldering and Brazing (Workshop Practice Series 09)

Chris Bailey — Soldering & Surface Mount Technology, Volume 14, Number 1, 2002

David M. Jacobson, Giles Humpston — Principles of Soldering

American Welding Society (auth.) — Soldering Manual

Jasbir Bath — Lead-free Soldering Process Development and Reliability

W.J. Plumbridge, R.J. Matela, A. Westwater — Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment

John X Wang — Green electronics manufacturing: creating environmental sensible products

Puligandla Viswanadham, Pratap Singh (auth.) — Failure Modes and Mechanisms in Electronic Packages

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